Rogers TMM10i High-Frequency PCB with Pure Gold Finish
1.Product Overview
Rogers Corporation's TMM10i represents a breakthrough in isotropic thermoset microwave materials, combining ceramic and polymer composite technologies for exceptional RF performance. This double-sided PCB features a nickel-free pure gold surface finish and ultra-precise 5/5 mil trace spacing, delivering unmatched reliability for demanding satellite communications, 5G infrastructure, and defense applications.
2.Key Material Properties
Exceptional Dielectric Stability: 9.8±0.245 Dk @10GHz
Ultra-Low Signal Loss: 0.0020 dissipation factor @10GHz
Superior Thermal Performance: 0.76 W/mK conductivity
Copper-Matched CTE: 19/19/20 ppm/K (X/Y/Z)
High-Temp Capability: 425°C decomposition temperature
Pure Gold Surface: Direct gold plating eliminates nickel contamination
Wire-Bond Ready: Thermoset resin base enables reliable bonding
3.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | TMM10i |
| Layer Count | Double Sided |
| Board Dimensions | 91mm × 91mm (±0.15mm) |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Thickness | 0.7mm |
| Copper Weight | 1oz (35μm) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Pure Gold (No Nickel) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
4.PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers TMM10i Core - 0.635 mm (25mil)
Copper_layer_2 - 35 μm
5.Board Statistics
Components: 15
Total Pads: 33
Thru Hole Pads: 21
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 42
Nets: 2
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Technical Advantages
Military-Grade Reliability: Proven in satellite and radar systems
Chemical Resistance: Withstands aggressive fabrication processes
Stable Performance: -43 ppm/°K ΔDk ensures frequency stability
Bonding Superiority: Ideal for gold wire bonding applications
Global Availability: Consistent quality worldwide supply
8.Target Applications
RF and microwave circuitry
Power amplifiers and combiners
Filters and coupler
Satellite communication systems
Global Positioning Systems Antennas
Patch Antennas
Dielectric polarizers and lenses
Chip testers